1. Lowest height in this package footprint.
2. Shielded construction.
3. Lowest DCR/µH, in this package size.
4. Designed for higher speed swith mode applications, requiring lower inductance and high current.
5. The products contain no lead and also support lead-free soldering.
Series | A(mm) | B(mm) | C(mm) | D(mm) | E(mm) |
SLPI 107975MT | 10.21±0.2 | 7.65±0.25 | 7.2±0.3 | 2.21±0.25 | 2.54±0.25 |
SLPI | 107975 | MT - | R22 | K - | M29 |
A | B | C | D | E | F |
A: Series
B: Dimension
C: Material
D: Inductance R12=0.12uH
E: Inductance Tolerance K=±10%,M=±20%.
F: DCR 印字:噴碼或移印.顏色:黑色.”R22”為感值.”1234”為週期(以實際生產週期而定) , ”.29”为DCR值.
| Inductance | Tolerance | Inductance | Frequency | DCR | I rms | I sat | I sat | |
Part Number | (uH) | (uH)MIN | (0.1V/Hz) | (mΩ) ±5.0% | (A) max. | (A) MAX | (A) MAX | ||
K | M | Isat@25℃ | @25℃ | @125℃ | |||||
SLPI 107975MT-R22K-M29 | 0.215 | ±10% | ±20% | 0.155 | 100K | 0.29 | 65 | 52 | 43 |