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SLPI-SERIES

Product Description

1. Lowest height in this package footprint.

2. Shielded construction.

3. Lowest DCR/µH, in this package size.

4. Designed for higher speed swith mode applications, requiring lower inductance and high current.

5. The products contain no lead and also support lead-free soldering.

 

 

Series

A(mm)

B(mm)

C(mm)

D(mm)

E(mm)

SLPI 107975MT

10.21±0.2

7.65±0.25

7.2±0.3

2.21±0.25

2.54±0.25

 

SLPI

107975

MT    -

R22

K   -

M29

A

B

              C

D

 E

F




A: Series

B: Dimension     

C: Material        

D: Inductance                     R12=0.12uH

E: Inductance Tolerance      K=±10%,M=±20%. 

F: DCR                                 印字:噴碼或移印.顏色:黑色.”R22”為感值.”1234”為週期(以實際生產週期而定) , ”.29”DCR.

 


 

Inductance

Tolerance

Inductance

Frequency

DCR

I rms

I sat

I sat

Part Number

(uH)

(uH)MIN

(0.1V/Hz)

(mΩ) ±5.0%

(A) max.

(A) MAX

(A) MAX

K

M

Isat@25

@25

@125

SLPI 107975MT-R22K-M29

0.215

±10%

±20%

0.155

100K

0.29

65

52

43

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